This application note provides guidelines for the handling and board mounting of NXP's PwrQFN packages including recommendations for printed-circuit.

Oct 22, 2024 — The objectives of this study are to analyze the influence of the variables from every parameter evaluated in the experiment on voiding area in ...

Nov 4, 2020 — VQFN is a near chip-scale plastic encapsulated package. It provides on the package bottom side perimeter pads and also a large die pad, which is typically also ...

These pre-molded QFN packages, created by Quik-Pak, provide a high quality, fast solution for your assembly needs.

0.25mm pitch and greater, ClamShell and Open-Top Socket Design, Compliant Socket Cover, Depth-controlled Wiping Contact, DFN, Heat Pipe, MLP, Optional Ground ...

The singulation process used on digital imgae processing (DIP) and Small Outline Integrated Circuit (SOIC) packages and the punch method of singulation are both ...

by C Liong · 2007 · Cited by 4 — QFN is increasingly being used on wireless cards, handhelds etc. However, QFN unique solder joints pose great challenges for AXI. This paper discusses lack ...

Our company has been known for its expertise in semiconductor back-end processing as we offer a total solution for assembly and testing to our valued customers.

Nov 21, 2024 — The presence of thermal mismatch between different materials of plastic IC packages was found to cause reliability and moldability issues such ...